Fundamentals of Microsystems Packaging

Fundamentals of Microsystems Packaging

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qLEARN ABOUT MICROSYSTEMS PACKAGING FROM THE GROUND UP Written by Rao Tummala, the fields leading author, Fundamentals of Microsystems Packaging is the only book to cover the field from wafer to systems, including every major contributing technology. This rigorous and thorough introduction to electronic packaging technologies gives you a solid grounding in microelectronics, photonics, RF, packaging design, assembly, reliability, testing, and manufacturing and its relevance to both semiconductors and systems. Youll find: *Full coverage of electrical, mechanical, chemical, and materials aspects of each technology *Easy-to-read schematics and block diagrams *Fundamental approaches to all system issues *Examples of all common configurations and technologieswafer level packaging, single chip, multichip, RF, opto-electronic, microvia boards, thermal and others *Details on chip-to-board connections, sealing and encapsulation, and manufacturing processes *Basics of electrical and reliability testingqWiring and connectors account for 49% of the average North American vehiclea#39;s aquot; electronic contentaquot; today, and even in ten ... Diptal Audio Broadcast Ob1ect Detection Systems Adaptive Cruise Control Night Vision Motor Control Swems Lowanbsp;...


Title:Fundamentals of Microsystems Packaging
Author: Tummala
Publisher:McGraw Hill Professional - 2001-05-08
ISBN-13:

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